Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device
| Autor: | Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H., Ekpu, M. |
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| Zdroj: | In Microelectronics Reliability July 2012 52(7):1409-1419 |
| Databáze: | ScienceDirect |
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