High-lead flip chip bump cracking on the thin organic substrate in a module package
| Autor: | Jang, J.W., Li, L., Bowles, P., Bonda, R., Frear, D.R. |
|---|---|
| Zdroj: | In Microelectronics Reliability 2012 52(2):455-460 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Jang, J.W., Li, L., Bowles, P., Bonda, R., Frear, D.R. |
|---|---|
| Zdroj: | In Microelectronics Reliability 2012 52(2):455-460 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect