Analysis of in situ monitored thermal cycling benefits for wireless packaging early reliability evaluation
| Autor: | Ferrara, Michael, Stephens, Michael, Marchut, Leslie, Yang, Chris, Fryar, Ventony, Scott, Preston |
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| Zdroj: | In Microelectronics Reliability 2012 52(1):9-15 |
| Databáze: | ScienceDirect |
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