Reliability of submicron InGaAs/InP DHBT under thermal and electrical stresses
| Autor: | Koné, G.A., Grandchamp, B., Hainaut, C., Marc, F., Maneux, C., Labat, N., Zimmer, T., Nodjiadjim, V., Riet, M., Godin, J. |
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| Zdroj: | In Microelectronics Reliability September-November 2011 51(9-11):1730-1735 |
| Databáze: | ScienceDirect |
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