Comparison of IGBT short-circuit failure “ohmic mode”: Epoxy molded package versus silicone gel module for new fail-safe and interruptible power converters
| Autor: | Richardeau, Frédéric, Dou, Zhifeng, Sarraute, Emmanuel, Blaquiere, Jean-Marc, Flumian, Didier |
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| Zdroj: | In Microelectronics Reliability September-November 2011 51(9-11):1919-1926 |
| Databáze: | ScienceDirect |
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