Study for the non-contact characterization of metallization ageing of power electronic semiconductor devices using the eddy current technique
| Autor: | Nguyen, T.A., Joubert, P.-Y., Lefebvre, S., Chaplier, G., Rousseau, L. |
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| Zdroj: | In Microelectronics Reliability 2011 51(6):1127-1135 |
| Databáze: | ScienceDirect |
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