Simulation and experimental analysis of large area substrate overmolding with epoxy molding compounds
| Autor: | Schreier-Alt, Thomas, Rehme, Frank, Ansorge, Frank, Reichl, Herbert |
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| Zdroj: | In Microelectronics Reliability 2011 51(3):668-675 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect