Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding
| Autor: | Shah, A., Rezvani, A., Mayer, M., Zhou, Y., Persic, J., Moon, J.T. |
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| Zdroj: | In Microelectronics Reliability 2011 51(1):67-74 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Shah, A., Rezvani, A., Mayer, M., Zhou, Y., Persic, J., Moon, J.T. |
|---|---|
| Zdroj: | In Microelectronics Reliability 2011 51(1):67-74 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect