Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces
| Autor: | Tseng, H.W., Lu, C.T., Hsiao, Y.H., Liao, P.L., Chuang, Y.C., Chung, T.Y., Liu, C.Y. |
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| Zdroj: | In Microelectronics Reliability 2010 50(8):1159-1162 |
| Databáze: | ScienceDirect |
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