Finite volume based CFD simulation of pressurized flip-chip underfill encapsulation process
| Autor: | Khor, C.Y., Abdul Mujeebu, M., Abdullah, M.Z., Che Ani, F. |
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| Zdroj: | In Microelectronics Reliability 2010 50(1):98-105 |
| Databáze: | ScienceDirect |
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