Physical degradation of GaN HEMT devices under high drain bias reliability testing

Autor: Park, S.Y., Floresca, Carlo, Chowdhury, Uttiya, Jimenez, Jose L., Lee, Cathy, Beam, Edward, Saunier, Paul, Balistreri, Tony, Kim, Moon J.
Zdroj: In Microelectronics Reliability 2009 49(5):478-483
Databáze: ScienceDirect