Correlation studies for component level ball impact shear test and board level drop test

Autor: Wong, E.H., Rajoo, R., Seah, S.K.W., Selvanayagam, C.S., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Tan, L.C., Leoni, M., Eu, P.L., Lai, Y.-S., Yeh, C.-L.
Zdroj: In Microelectronics Reliability 2008 48(7):1069-1078
Databáze: ScienceDirect