Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration
| Autor: | Chen, Kuo-Ming, Wu, J.D., Chiang, Kuo-Ning |
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| Zdroj: | In Microelectronics Reliability 2006 46(12):2104-2111 |
| Databáze: | ScienceDirect |
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| Autor: | Chen, Kuo-Ming, Wu, J.D., Chiang, Kuo-Ning |
|---|---|
| Zdroj: | In Microelectronics Reliability 2006 46(12):2104-2111 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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Full Text from ScienceDirect