Effects of bonding force on contact pressure and frictional energy in wire bonding
| Autor: | Ding, Yong, Kim, Jang-Kyo, Tong, Pin |
|---|---|
| Zdroj: | In Microelectronics Reliability 2006 46(7):1101-1112 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Ding, Yong, Kim, Jang-Kyo, Tong, Pin |
|---|---|
| Zdroj: | In Microelectronics Reliability 2006 46(7):1101-1112 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect