Innovative packaging technique for backside optical testing of wire-bonded chips
| Autor: | Tosi, A., Stellari, F., Zappa, F. |
|---|---|
| Zdroj: | In Microelectronics Reliability 2005 45(9):1493-1498 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Tosi, A., Stellari, F., Zappa, F. |
|---|---|
| Zdroj: | In Microelectronics Reliability 2005 45(9):1493-1498 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect