High-temperature reliability of Flip Chip assemblies
| Autor: | Braun, T., Becker, K.-F., Koch, M., Bader, V., Aschenbrenner, R., Reichl, H. |
|---|---|
| Zdroj: | In Microelectronics Reliability 2006 46(1):144-154 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Braun, T., Becker, K.-F., Koch, M., Bader, V., Aschenbrenner, R., Reichl, H. |
|---|---|
| Zdroj: | In Microelectronics Reliability 2006 46(1):144-154 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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Full Text from ScienceDirect