Thermal resistance analysis and validation of flip chip PBGA packages
| Autor: | Chen, Kuo-Ming, Houng, Kuo-Hsiung, Chiang, Kuo-Ning |
|---|---|
| Zdroj: | In Microelectronics Reliability 2006 46(2):440-448 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Chen, Kuo-Ming, Houng, Kuo-Hsiung, Chiang, Kuo-Ning |
|---|---|
| Zdroj: | In Microelectronics Reliability 2006 46(2):440-448 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect