Residual compression in area array packages induced by underfill shrinkage
Autor: | Larson, Michael C., Verges, Melody A., Liu, Xia |
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Zdroj: | In Microelectronics Reliability 2006 46(2):496-502 |
Databáze: | ScienceDirect |
Externí odkaz: |
Autor: | Larson, Michael C., Verges, Melody A., Liu, Xia |
---|---|
Zdroj: | In Microelectronics Reliability 2006 46(2):496-502 |
Databáze: | ScienceDirect |
Externí odkaz: |