Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives

Autor: Zhang, Xiaowu, Wong, E.H., Rajoo, Ranjan, Iyer, Mahadevan K., Caers, J.F.J.M., Zhao, X.J.
Zdroj: In Microelectronics Reliability 2005 45(7):1215-1221
Databáze: ScienceDirect
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