Pull-off test in the assessment of adhesion at printed wiring board metallisation/epoxy interface
| Autor: | Turunen, Markus P.K, Marjamäki, Pekka, Paajanen, Matti, Lahtinen, Jouko, Kivilahti, Jorma K |
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| Zdroj: | In Microelectronics Reliability 2004 44(6):993-1007 |
| Databáze: | ScienceDirect |
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