Long time reliability study of soldered flip chips on flexible substrates
| Autor: | Pahl, Barbara, Kallmayer, Christine, Aschenbrenner, Rolf, Reichl, Herbert |
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| Zdroj: | In Microelectronics Reliability 2004 44(2):309-314 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect