Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping
| Autor: | Manessis, Dionysios, Patzelt, Rainer, Ostmann, Andreas, Aschenbrenner, Rolf, Reichl, Herbert |
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| Zdroj: | In Microelectronics Reliability 2004 44(5):797-803 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect