A study of considering the reliability issues on ASIC/Memory integration by SIP (System-in-Package) technology
| Autor: | Song, Yong-Ha, Kim, S.G., Lee, S.B., Rhee, K.J., Kim, T.S. |
|---|---|
| Zdroj: | In Microelectronics Reliability 2003 43(9):1405-1410 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect