Impact of probing procedure on flip chip reliability
| Autor: | Chen, Kuo-Ming, Chiang, Kuo-Ning |
|---|---|
| Zdroj: | In Microelectronics Reliability 2003 43(1):123-130 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Chen, Kuo-Ming, Chiang, Kuo-Ning |
|---|---|
| Zdroj: | In Microelectronics Reliability 2003 43(1):123-130 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect