Fast temperature cycling and electromigration induced thin film cracking in multilevel interconnection: experiments and modeling
| Autor: | Nguyen, H.V., Salm, C., Vroemen, J., Voets, J., Krabbenborg, B., Bisschop, J., Mouthaan, A.J., Kuper, F.G. |
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| Zdroj: | In Microelectronics Reliability 2002 42(9):1415-1420 |
| Databáze: | ScienceDirect |
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