Bump formation for flip chip and CSP by solder paste printing
| Autor: | Kloeser, Joachim, Coskina, Paradiso, Aschenbrenner, Rolf, Reichl, Herbert |
|---|---|
| Zdroj: | In Microelectronics Reliability 2002 42(3):391-398 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Kloeser, Joachim, Coskina, Paradiso, Aschenbrenner, Rolf, Reichl, Herbert |
|---|---|
| Zdroj: | In Microelectronics Reliability 2002 42(3):391-398 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect