Effect of solder creep on the reliability of large area die attachment
| Autor: | Zhuang, W.D., Chang, P.C., Chou, F.Y., Shiue, R.K. |
|---|---|
| Zdroj: | In Microelectronics Reliability 2001 41(12):2011-2021 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Zhuang, W.D., Chang, P.C., Chou, F.Y., Shiue, R.K. |
|---|---|
| Zdroj: | In Microelectronics Reliability 2001 41(12):2011-2021 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect