Electromigration characterization of damascene copper interconnects using normally and highly accelerated tests
| Autor: | Berger, T., Arnaud, L., Gonella, R., Lormand, G., Morand, Y. |
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| Zdroj: | In Microelectronics Reliability August-October 2000 40(8-10):1311-1316 |
| Databáze: | ScienceDirect |
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