An optimized through-via bottom-up method for simultaneous-filling TSVS of different aspect-ratios and its potential application on high-frequency passive interposer

Autor:	Zhang, Weibo, Gu, Jiebin, Xu, Gaowei, Luo, Le, Li, Xinxin
Zdroj:	In Microelectronics Journal July 2020 101
Databáze:	ScienceDirect
Externí odkaz:	Zobrazit plný text záznamu Full Text from ScienceDirect