Thermal management challenges and mitigation techniques for transistor-level 3-D integration
| Autor: | Iqbal, Md Arif *, Macha, Naveen Kumar, Danesh, Wafi, Hossain, Sehtab, Rahman, Mostafizur |
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| Zdroj: | In Microelectronics Journal September 2019 91:61-69 |
| Databáze: | ScienceDirect |
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