Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations

Autor: Yang, Xu-Sheng, Wang, Yun-Jiang, Zhai, Hui-Ru, Wang, Guo-Yong, Su, Yan-Jing, Dai, L.H., Ogata, Shigenobu, Zhang, Tong-Yi
Zdroj: In Journal of the Mechanics and Physics of Solids September 2016 94:191-206
Databáze: ScienceDirect
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