Re-dissolution of copper deposited onto porous silicon in immersion plating
| Autor: | Sasano, J. *, Murota, R., Yamauchi, Y., Sakka, T., Ogata, Y.H. |
|---|---|
| Zdroj: | In Journal of Electroanalytical Chemistry 2003 559:125-130 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect