Application of the narrow spectral range InAs-FPA-based IR camera for the investigation of the interface voids in silicon wafer bonding
Autor: | Vainer, B.G *, Kamaev, G.N, Kurishev, G.L |
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Zdroj: | In Journal of Crystal Growth 2000 210(1):351-355 |
Databáze: | ScienceDirect |
Externí odkaz: |