Dynamic peeling process of IC chip from substrate based on a 3D analytical model
| Autor: | Fu, Jinping, Du, Wei, Hou, Huiming, Zhao, Xiaohua, Wu, Tao |
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| Zdroj: | In International Journal of Solids and Structures 1 September 2023 279 |
| Databáze: | ScienceDirect |
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