Thermomechanical finite element modeling of Cu–SiO2 direct hybrid bonding with a dishing effect on Cu surfaces
| Autor: | Beilliard, Y., Estevez, R., Parry, G., McGarry, P., Di Cioccio, L., Coudrain, P. |
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| Zdroj: | In International Journal of Solids and Structures 15 June 2017 117:208-220 |
| Databáze: | ScienceDirect |
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