Deformation of solder joint under current stressing and numerical simulation––II
| Autor: | Ye, Hua, Basaran, Cemal, Hopkins, Douglas C |
|---|---|
| Zdroj: | In International Journal of Solids and Structures 2004 41(18):4959-4973 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Ye, Hua, Basaran, Cemal, Hopkins, Douglas C |
|---|---|
| Zdroj: | In International Journal of Solids and Structures 2004 41(18):4959-4973 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect