Characterization and computational modeling of electrical wires and wire bundles subject to bending loads

Autor: Taghipour, Ehsan, Vemula, Sai Siddhartha, Wang, Zhengdi, Zhou, Yitong, Qarib, Hossein, Gargesh, Kushal, Headings, Leon M., Dapino, Marcelo J., Soghrati, Soheil
Zdroj: In International Journal of Mechanical Sciences May 2018 140:211-227
Databáze: ScienceDirect