Thermal contact analysis of cracked through-silicon via structures in integrated circuits
| Autor: | Wu, Tao, Xue, Tao ⁎, Zhang, Xiaobing ⁎ |
|---|---|
| Zdroj: | In International Journal of Heat and Mass Transfer April 2025 239 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Wu, Tao, Xue, Tao ⁎, Zhang, Xiaobing ⁎ |
|---|---|
| Zdroj: | In International Journal of Heat and Mass Transfer April 2025 239 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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Full Text from ScienceDirect