Embedded microfluidic cooling with compact double H type manifold microchannels for large-area high-power chips

Autor: Yang, Yuchi, Du, Jianyu, Li, Motong, Li, Weihao, Wang, Qi, Wen, Bo, Zhang, Chi, Jin, Yufeng, Wang, Wei
Zdroj: In International Journal of Heat and Mass Transfer 15 November 2022 197
Databáze: ScienceDirect