Embedded microfluidic cooling with compact double H type manifold microchannels for large-area high-power chips
Autor: | Yang, Yuchi, Du, Jianyu, Li, Motong, Li, Weihao, Wang, Qi, Wen, Bo, Zhang, Chi, Jin, Yufeng, Wang, Wei |
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Zdroj: | In International Journal of Heat and Mass Transfer 15 November 2022 197 |
Databáze: | ScienceDirect |
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