A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics

Autor: Drummond, Kevin P., Back, Doosan, Sinanis, Michael D., Janes, David B., Peroulis, Dimitrios, Weibel, Justin A., Garimella, Suresh V.
Zdroj: In International Journal of Heat and Mass Transfer February 2018 117:319-330
Databáze: ScienceDirect