Grain orientations and failure mechanism of isothermal aged nano Sn-3Ag-0.5Cu/Cu solder joints by microwave hybrid heating and shear mechanical strength
| Autor: | Zhang, Shuai, Zhou, Hongzhi, Ding, Tianran, Long, Weimin, Zhong, Sujuan, Paik, Kyung-Wook, He, Peng, Zhang, Shuye |
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| Zdroj: | In Engineering Fracture Mechanics 8 March 2024 298 |
| Databáze: | ScienceDirect |
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