Study on subsurface microcrack damage depth of diamond wire as-sawn sapphire crystal wafers
| Autor: | Zhu, Zhenfeng, Gao, Yufei, Zhang, Xingchun |
|---|---|
| Zdroj: | In Engineering Fracture Mechanics 14 July 2023 287 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
| Autor: | Zhu, Zhenfeng, Gao, Yufei, Zhang, Xingchun |
|---|---|
| Zdroj: | In Engineering Fracture Mechanics 14 July 2023 287 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect