Simulation of crack propagation in solder layer of IGBT device under temperature shock by viscoplastic phase field method
| Autor: | Yang, Kai, Zhou, Longzao, Wu, Fengshun, Yang, Guang, Ding, Liguo, Li, Kewei, Li, Xuemin |
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| Zdroj: | In Engineering Fracture Mechanics 19 May 2023 284 |
| Databáze: | ScienceDirect |
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