Study on the subsurface damage depth of monocrystalline silicon in ultrasonic vibration assisted diamond wire sawing
| Autor: | Wang, Yan, Zhao, Bocheng, Huang, Shengju, Qian, Zhaofeng |
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| Zdroj: | In Engineering Fracture Mechanics December 2021 258 |
| Databáze: | ScienceDirect |
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