Fracture strength of photovoltaic silicon wafers cut by diamond wire saw based on half-penny crack system
| Autor: | Wang, Liyuan, Gao, Yufei, Pu, Tianzhao, Yin, Youkang |
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| Zdroj: | In Engineering Fracture Mechanics 15 June 2021 251 |
| Databáze: | ScienceDirect |
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