Full-field identification of mixed-mode adhesion properties in a flexible, multi-layer microelectronic material system

Autor: Ruybalid, A.P., van der Sluis, O., Geers, M.G.D., Hoefnagels, J.P.M.
Zdroj: In Engineering Fracture Mechanics 1 March 2020 226
Databáze: ScienceDirect