Metal seed layer sputtering on high aspect ratio through-silicon-vias for copper filling electroplating
| Autor: | Song, Young Sik, Yim, TaiHong, Park, Soo-Keun, Lee, Jae-Ho, Kim, Jongryoul |
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| Zdroj: | In Electrochimica Acta 30 December 2013 114:832-837 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect