Electrodeposition and characterisation of Sn–Ag–Cu solder alloys for flip-chip interconnection
| Autor: | Qin, Yi, Wilcox, G.D., Liu, Changqing |
|---|---|
| Zdroj: | In Electrochimica Acta 2010 56(1):183-192 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Qin, Yi, Wilcox, G.D., Liu, Changqing |
|---|---|
| Zdroj: | In Electrochimica Acta 2010 56(1):183-192 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect