Formation and characterization of low resistivity sub-100 nm copper films deposited by electroless on SAM

Autor: Asher, T., Inberg, A., Glickman, E., Fishelson, N., Shacham-Diamand, Y.
Zdroj: In Electrochimica Acta 2009 54(25):6053-6057
Databáze: ScienceDirect