Effect of plating mode, thiourea and chloride on the morphology of copper deposits produced in acidic sulphate solutions
| Autor: | Tantavichet, Nisit, Pritzker, Mark D. * |
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| Zdroj: | In Electrochimica Acta 2005 50(9):1849-1861 |
| Databáze: | ScienceDirect |
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